Invention Grant
- Patent Title: Paste and process for forming a solderable polyimide-based polymer thick film conductor
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Application No.: US14824202Application Date: 2015-08-12
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Publication No.: US09649730B2Publication Date: 2017-05-16
- Inventor: Seigi Suh
- Applicant: E I DU PONT DE NEMOURS AND COMPANY
- Applicant Address: US DE Wilmington
- Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- Main IPC: H01B1/22
- IPC: H01B1/22 ; C09D5/24 ; B23K35/30 ; H05K1/09 ; B23K35/02 ; B23K35/36
Abstract:
The invention is directed to a paste composition and a process for forming a solderable polyimide-based polymer thick film conductor. The paste composition comprising an electrically conductive metal, a polyimide, an organosilicon compound and an organic solvent and can be cured by heating at a temperature of 320 to 380° C. The invention also provides an electrical device containing a solderable polyimide-based polymer thick film conductor formed using the paste composition.
Public/Granted literature
- US20170043435A1 PASTE AND PROCESS FOR FORMING A SOLDERABLE POLYIMIDE-BASED POLYMER THICK FILM CONDUCTOR Public/Granted day:2017-02-16
Information query
