Invention Grant
- Patent Title: Resealable label flap with tamper evident structure
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Application No.: US14557548Application Date: 2014-12-02
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Publication No.: US09650194B2Publication Date: 2017-05-16
- Inventor: Scott Hetherton
- Applicant: HFM Packaging, Ltd.
- Applicant Address: US WI Pewaukee
- Assignee: HFM Packaging, LTD.
- Current Assignee: HFM Packaging, LTD.
- Current Assignee Address: US WI Pewaukee
- Agency: Andrus Intellectual Property Law, LLP
- Main IPC: B65D75/58
- IPC: B65D75/58 ; B65D65/14 ; B65D79/02 ; B65D75/04 ; B65D65/40 ; G09F3/00 ; B32B7/00 ; B32B7/04 ; B32B7/06 ; B32B7/10 ; B32B7/12 ; B32B27/00 ; B32B27/06 ; B32B27/08 ; B32B27/18 ; B32B27/28 ; B32B1/00 ; B32B3/00 ; B32B3/06 ; B32B3/08 ; G09F3/02

Abstract:
A tamper evident label flap positioned to cover an opening in a package. The label flap includes a base layer having a top surface and a bottom surface. A top layer is attached to the base layer by an adhesive layer. A tamper evident structure is located in at least one designated area between the base layer and the top layer. The tamper evident structure includes a first ink layer applied to the base layer and a second ink layer applied to the first ink layer. The first ink layer and the second ink layer are held together in a weaker bond than a bond between the top layer and the base layer. When the label flap is initially pulled from the package, the first ink layer and the second ink layer separate and define a visible permanent de-lamination which signifies the package has been opened.
Public/Granted literature
- US20160152393A1 RESEALABLE LABEL FLAP WITH TAMPER EVIDENT STRUCTURE Public/Granted day:2016-06-02
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