Invention Grant
- Patent Title: Absorbing-layer-forming composition and absorbing substrate, printed item, conductive pattern, and electric circuit produced using the same
-
Application No.: US14762789Application Date: 2014-01-16
-
Publication No.: US09650522B2Publication Date: 2017-05-16
- Inventor: Wataru Fujikawa , Jun Shirakami , Akira Murakawa , Yukie Saitou
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2013-010145 20130123
- International Application: PCT/JP2014/050646 WO 20140116
- International Announcement: WO2014/115629 WO 20140731
- Main IPC: H05K1/09
- IPC: H05K1/09 ; C09D11/102 ; B41J2/01 ; C09D11/52 ; B41M5/52 ; H05K3/12 ; H05K3/18

Abstract:
The present invention provides an absorbing-layer-forming composition including a blocked isocyanate such that the amount of the blocked isocyanate is 50% by mass to 100% by mass of the solid content of the absorbing-layer-forming composition and an absorbing substrate, a printed item, and a conductive pattern that are formed using the absorbing-layer-forming composition. The absorbing-layer-forming composition according to the present invention can be used for forming an absorbing layer which is capable of carrying a fluid such as an ink therein and which enables good adhesion between various types of supports and a conductive layer to be achieved. In particular, using a blocked isocyanate having a number-average molecular weight of 1,000 to 5,000 further increases the adhesion between various types of supports and the conductive layer.
Public/Granted literature
Information query