- Patent Title: Radiation-curable pressure-sensitive adhesive, radiation-curable pressure-sensitive adhesive layer, radiation-curable pressure-sensitive adhesive sheet, and laminate
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Application No.: US13954686Application Date: 2013-07-30
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Publication No.: US09650547B2Publication Date: 2017-05-16
- Inventor: Kiyoe Shigetomi , Shou Takarada , Masahiko Ando , Katsuhiko Kamiya , Takahiro Nonaka
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-169994 20120731; JP2013-028076 20130215
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09J133/08 ; C09J133/14 ; B32B7/12 ; B32B3/10 ; C08F20/68 ; C08F220/68 ; C08K5/00

Abstract:
Provided is a pressure-sensitive adhesive capable of realizing a pressure-sensitive adhesive layer having satisfactory adhesion performance and a high ink step absorbability. A radiation-curable pressure-sensitive adhesive, which contains a (meth)acryl-based polymer obtained by polymerizing a monomer component containing 30 to 90% by weight of an alkyl(meth)acrylate having an alkyl group of 10 to 22 carbon atoms at an ester end, and having a radically polymerizable functional group containing a carbon-carbon double bond.
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