Invention Grant
- Patent Title: Sensor arrangement structure
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Application No.: US14834656Application Date: 2015-08-25
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Publication No.: US09651438B2Publication Date: 2017-05-16
- Inventor: Akira Tokito
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2014-193264 20140924
- Main IPC: G01L3/02
- IPC: G01L3/02 ; G01L3/10 ; G01P3/44 ; G01L5/00 ; G01P1/02

Abstract:
A sensor arrangement structure includes an output shaft provided with a disc portion at a leading end portion thereof. An output shaft cover has an inner surface portion disposed along and close to the disc portion. The disc portion is provided with ribs, the ribs extending in a radial direction of the disc portion while protruding toward the inner surface portion. A detector is disposed more inward in the radial direction of the disc portion than the ribs.
Public/Granted literature
- US20160084721A1 SENSOR ARRANGEMENT STRUCTURE Public/Granted day:2016-03-24
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