Invention Grant
- Patent Title: Thin film transistor array substrate and manufacturing method thereof
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Application No.: US14888416Application Date: 2015-06-10
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Publication No.: US09651843B2Publication Date: 2017-05-16
- Inventor: Xiangyang Xu
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201510166111 20150409
- International Application: PCT/CN2015/081163 WO 20150610
- International Announcement: WO2016/161700 WO 20161013
- Main IPC: H01L29/04
- IPC: H01L29/04 ; G02F1/1368 ; H01L27/12 ; H01L29/786 ; H01L29/49 ; H01L29/66 ; G02F1/1343 ; G02F1/1362

Abstract:
A thin film transistor array substrate comprises a bottom gate disposed on a substrate and a bottom gate insulating layer covering the bottom gate, a semiconductor oxide layer disposed on the bottom gate insulating layer and an etch blocking layer covering the semiconductor oxide layer and including a first via, a drain disposed on the etch blocking layer contacting with the semiconductor oxide layer through the first via and an insulating protection layer covering the drain, a second via arranged in the insulating protection layer, the etch blocking layer and the bottom gate insulating layer, a top gate disposed on insulating protection layer contacting with the bottom gate through the second via. The disclosure further discloses a method for manufacturing a thin film transistor array substrate. The thin film transistor of the disclosure prevents the threshold voltage thereof from being drifted in a case of negative bias illumination stress (NBIS).
Public/Granted literature
- US20170017103A1 Thin Film Transistor Array Substrate and Manufacturing Method Thereof Public/Granted day:2017-01-19
Information query
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