An array of electrical components may be mounted in openings in an electronic device housing. Gaskets may be used to seal the electrical components to a housing wall. The housing wall may be planar or may have a cylindrical shape or other curved shape. A support structure such as a hollow tube may be mounted within the interior of a cavity region defined by the housing wall. The electrical components may be radially deployed into the openings. Mating ramped structures may be translated with respect to each other to push elongated strips of components outward or each electrical component may be pushed outward using a threaded nut that engages threads on the electrical component.