Invention Grant
- Patent Title: Processor module, micro-server, and method of using processor module
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Application No.: US14148962Application Date: 2014-01-07
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Publication No.: US09652427B2Publication Date: 2017-05-16
- Inventor: Ha-uk Ryu
- Applicant: Samsung Electronics Co., Ltd
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: KR10-2013-0001768 20130107; KR10-2013-0148406 20131202
- Main IPC: G06F3/00
- IPC: G06F3/00 ; G06F13/40
Abstract:
A processor module includes at least one storage device, at least one central processing unit (CPU) that uses a preset interface, and a module controller to relay a connection between a common interface bus formed on the based board and an interface used by the CPU.
Public/Granted literature
- US20140195712A1 PROCESSOR MODULE, MICRO-SERVER, AND METHOD OF USING PROCESSOR MODULE Public/Granted day:2014-07-10
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