Invention Grant
- Patent Title: Method for producing electronic component
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Application No.: US14142418Application Date: 2013-12-27
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Publication No.: US09653209B2Publication Date: 2017-05-16
- Inventor: Atsushi Seko
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2013-023450 20130208
- Main IPC: H01F41/04
- IPC: H01F41/04 ; H01F17/00 ; H05K3/00

Abstract:
A method for producing an electronic component including a laminate, a circuit element provided therein, and external conductors electrically connected thereto. The method including steps of obtaining a mother laminate that has a plurality of the laminates arranged in a matrix-like state in a first direction and a second direction perpendicular thereto. The mother laminate is cut into the laminates. In the step of obtaining, the mother laminate is obtained such that the external conductors of two laminates adjacent in the first direction are joined, and circuit elements provided in the two laminates have a point-symmetrical relationship with each other. In the step of cutting, the mother laminate is cut along first cutoff lines extending in the second direction after the mother laminate is cut along second cutoff lines extending in the first direction. The external conductors are located on corresponding first cutoff lines.
Public/Granted literature
- US20140224418A1 METHOD FOR PRODUCING ELECTRONIC COMPONENT Public/Granted day:2014-08-14
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