Invention Grant
- Patent Title: Method of forming ultra-thin nanowires
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Application No.: US14941909Application Date: 2015-11-16
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Publication No.: US09653288B1Publication Date: 2017-05-16
- Inventor: Martin Christopher Holland , Blandine Duriez
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/306 ; H01L21/311 ; H01L29/06

Abstract:
Provided is a method of forming a nanowire-based device. The method includes forming a first mask layer over a substrate; forming a first opening in the first mask layer; growing a first nanowire that protrudes through the first opening in the first mask layer, wherein the first nanowire has a first diameter; removing the first mask layer; oxidizing a sidewall of the first nanowire; etching the oxidized sidewall of the first nanowire; forming a second mask layer overlaying the substrate; removing the first nanowire thereby forming a second opening in the second mask layer; and growing a second nanowire that protrudes through the second opening in the second mask layer, wherein the second nanowire has a second diameter and the second diameter is different than the first diameter.
Public/Granted literature
- US20170140932A1 METHOD OF FORMING ULTRA-THIN NANOWIRES Public/Granted day:2017-05-18
Information query
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