Invention Grant
- Patent Title: Semiconductor component with field electrode between adjacent semiconductor fins and method for producing such a semiconductor component
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Application No.: US14953103Application Date: 2015-11-27
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Publication No.: US09653305B2Publication Date: 2017-05-16
- Inventor: Stefan Tegen , Marko Lemke , Rolf Weis
- Applicant: Infineon Technologies Dresden GmbH
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH
- Current Assignee: Infineon Technologies Dresden GmbH
- Current Assignee Address: DE Dresden
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102014117558 20141128
- Main IPC: H01L21/283
- IPC: H01L21/283 ; H01L29/808 ; H01L29/78 ; H01L29/66 ; H01L29/40 ; H01L29/423 ; H01L27/088 ; H01L29/04 ; H01L21/8234

Abstract:
A semiconductor component includes semiconductor fins formed between a base plane and a main surface of a semiconductor body. Each semiconductor fin includes a source region formed between the main surface and a channel/body region, and a drift zone formed between the channel/body region and the base plane. The semiconductor component further includes gate electrode structures on two mutually opposite sides of each channel/body region, and a field electrode structure between mutually adjacent ones of the semiconductor fins. Each field electrode structure is separated from the drift zone by a field dielectric and extends from the main surface as far as the base plane. The gate electrode structures assigned to the mutually adjacent semiconductor fins enclose an upper portion of the corresponding field electrode structure from two sides.
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