Invention Grant
- Patent Title: Method for fabricating a semiconductor package
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Application No.: US14311431Application Date: 2014-06-23
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Publication No.: US09653322B2Publication Date: 2017-05-16
- Inventor: Martin Standing , Andrew Roberts
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/48 ; H01L23/538 ; H01L23/00 ; H05K1/18
Abstract:
Representative implementations of devices and techniques provide a semiconductor package comprising a laminate substrate. The laminate substrate includes at least one conductive layer laminated to a surface of an insulating core. The laminate substrate also includes one or more die openings, in which one or more semiconductor die are located.
Public/Granted literature
- US20150371935A1 EMBEDDED CHIP PACKAGING TECHNOLOGY Public/Granted day:2015-12-24
Information query
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