Invention Grant
- Patent Title: Integrated circuit package with probe pad structure
-
Application No.: US15053440Application Date: 2016-02-25
-
Publication No.: US09653427B2Publication Date: 2017-05-16
- Inventor: Chi-Hsi Wu , Chen-Hua Yu , Hsiang-Fan Lee , Shih-Peng Tai , Tang-Jung Chiu , Wen-Chih Chiou
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L21/66 ; H01L21/78 ; H01L23/00
Abstract:
A package includes a substrate, the substrate having a first side and a second side, the second side being opposite the first side, and a stack of dies on a first side of the substrate. The package further includes a probing pad on the first side of the substrate, the probing pad being electrically coupled to the stack of dies, and a contact pad on the second side of the substrate, the contact pad being electrically coupled to the stack of dies.
Public/Granted literature
- US20160172333A1 Integrated Circuit Package and Methods of Forming Same Public/Granted day:2016-06-16
Information query
IPC分类:
