Invention Grant
- Patent Title: FinFETs with low source/drain contact resistance
-
Application No.: US14229218Application Date: 2014-03-28
-
Publication No.: US09653461B2Publication Date: 2017-05-16
- Inventor: Yu-Lien Huang , Tung Ying Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/306 ; H01L21/311 ; H01L21/285 ; H01L21/8234 ; H01L29/45 ; H01L29/78 ; H01L29/66 ; H01L21/768

Abstract:
An integrated circuit structure includes a semiconductor substrate, insulation regions extending into the semiconductor substrate, with the insulation regions including first top surfaces and second top surfaces lower than the first top surfaces, a semiconductor fin over the first top surfaces of the insulation regions, a gate stack on a top surface and sidewalls of the semiconductor fin, and a source/drain region on a side of the gate stack. The source/drain region includes a first portion having opposite sidewalls that are substantially parallel to each other, with the first portion being lower than the first top surfaces and higher than the second top surfaces of the insulation regions, and a second portion over the first portion, with the second portion being wider than the first portion.
Public/Granted literature
- US20150279840A1 FINFETS WITH LOW SOURCE/DRAIN CONTACT RESISTANCE Public/Granted day:2015-10-01
Information query
IPC分类: