Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing solid-state imaging device, and imaging apparatus
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Application No.: US14246654Application Date: 2014-04-07
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Publication No.: US09653502B2Publication Date: 2017-05-16
- Inventor: Kai Yoshitsugu
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2011-053237 20110310
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146 ; H04N5/369
Abstract:
There is provided a solid-state imaging device including a semiconductor substrate having an effective region in which a photodiode performing a photoelectric conversion is formed and, an optical black region shielded by a light shielding film; a first film which is formed on the effective region and in which at least one layer or more of layers having a negative fixed charge are laminated; and a second film which is formed on the light shielding region and in which at least one layer or more of layers having a negative fixed charge are laminated, in which the number of layers formed in the first film is different from the number of layers formed in the second film.
Public/Granted literature
- US20140218574A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND IMAGING APPARATUS Public/Granted day:2014-08-07
Information query
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