Invention Grant
- Patent Title: Connection structure for vertical gate all around (VGAA) devices on semiconductor on insulator (SOI) substrate
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Application No.: US14256122Application Date: 2014-04-18
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Publication No.: US09653563B2Publication Date: 2017-05-16
- Inventor: Jhon-Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L29/423 ; H01L27/12 ; H01L29/06 ; H01L27/118 ; H01L27/11

Abstract:
A vertical gate all around (VGAA) nanowire device circuit routing structure is disclosed. The circuit routing structure comprises a plurality of VGAA nanowire devices including a NMOS and a PMOS device. The devices are formed on a semiconductor-on-insulator substrate. Each device comprises a bottom plate and a top plate wherein one of the bottom and top plates serves as a drain node and the other serves as a source node. Each device further comprises a gate layer. The gate layer fully surrounds a vertical channel in the device. In one example, a CMOS circuit is formed with an oxide (OD) block layer that serves as a common bottom plate for the NMOS and PMOS devices. In another example, a CMOS circuit is formed with a top plate that serves as a common top plate for the NMOS device and the PMOS devices. In another example, a SRAM circuit is formed.
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