Invention Grant
- Patent Title: Circuit board
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Application No.: US14938900Application Date: 2015-11-12
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Publication No.: US09655229B2Publication Date: 2017-05-16
- Inventor: Tae-Hong Min , Myung-Sam Kang , Young-Gwan Ko
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0158270 20141113
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/18 ; H05K3/46 ; H05K3/44
Abstract:
A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.
Public/Granted literature
- US20160143129A1 CIRCUIT BOARD Public/Granted day:2016-05-19
Information query
