Invention Grant
- Patent Title: Backdrilling method, and backdrilling apparatus
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Application No.: US14627382Application Date: 2015-02-20
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Publication No.: US09655251B2Publication Date: 2017-05-16
- Inventor: Yujiro Araki , Toru Yuki , Katsunori Tokinaga
- Applicant: Via Mechanics, Ltd.
- Applicant Address: JP Ebina-shi
- Assignee: Via Mechanics, Ltd.
- Current Assignee: Via Mechanics, Ltd.
- Current Assignee Address: JP Ebina-shi
- Agency: Crowell & Moring LLP
- Priority: JP2014-032000 20140221; JP2014-261418 20141225; JP2015-019220 20150203
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K3/42 ; H05K1/02

Abstract:
The present invention aims to provide a backdrilling method and a backdrilling apparatus that can ensure the backdrilling depth accuracy. Using a multilayer printed wiring board in which a reference depth detection region is allocated where a reference depth detection layer is formed in the same layer with an internal wiring layer electrically connected to a stub, the thickness and the depth of the reference depth detection layer are measured in the reference depth detection region using a drill bit. The drill bit is moved relative to the multilayer printed wiring board to a backdrilling portion. The drilling is performed using the drill bit to the depth which is calculated using the ratio of the depth of the reference depth detection layer to the thickness of the multilayer printed wiring board in the reference depth detection region.
Public/Granted literature
- US20150245494A1 Backdrilling Method, and Backdrilling Apparatus Public/Granted day:2015-08-27
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