Invention Grant
- Patent Title: Support system for printed board assemblies
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Application No.: US14709842Application Date: 2015-05-12
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Publication No.: US09655269B2Publication Date: 2017-05-16
- Inventor: Dariush Y. Paykarimah
- Applicant: HONEYWELL INTERNATIONAL INC.
- Applicant Address: US NJ Morris Plains
- Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee Address: US NJ Morris Plains
- Agency: Shimokaji IP
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K7/20

Abstract:
Apparatus for guiding insertion and locking of a printed board assembly (PBA) in an electronic unit may include a housing, a first wedge segment having a sloped planar contact surface and a second wedge segment adjacent the first wedge segment and having a sloped planar contact surface. The first and second wedge segments may be devoid of holes in their respective sloped planar contact surfaces. The wedge segments may be supported in the housing so that the sloped contact surface of the first wedge segment is adjacent the sloped contact surface of the second wedge segment.
Public/Granted literature
- US20160338215A1 SUPPORT SYSTEM FOR PRINTED BOARD ASSEMBLIES Public/Granted day:2016-11-17
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