Invention Grant
- Patent Title: Laser processing apparatus
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Application No.: US14701856Application Date: 2015-05-01
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Publication No.: US09656348B2Publication Date: 2017-05-23
- Inventor: Masaru Nakamura
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2014-097704 20140509
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/03 ; B23K26/08 ; B23K26/0622 ; B24C1/06 ; B23K26/402 ; B23K26/364 ; B23K101/40

Abstract:
A laser processing apparatus includes a holding table for holding a workpiece, a laser beam applying unit for applying a laser beam to the workpiece, a feeding mechanism for relatively moving the holding table and the laser beam applying unit, a detector for applying detection light to the workpiece and detecting the quantity of reflected light obtained by the reflection of the detection light from the workpiece, and a controller for determining whether or not the workpiece is present at a laser beam applying position according to a detection signal output from the detector. The holding table includes a holding member for holding the workpiece under suction and an annular mount member provided so as to surround the holding member for mounting the holding member. The mount member has an upper surface treated by an irregular reflection process for irregularly reflecting light.
Public/Granted literature
- US20150321284A1 LASER PROCESSING APPARATUS Public/Granted day:2015-11-12
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