Invention Grant
- Patent Title: Device for gripping substrate without contact
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Application No.: US14708837Application Date: 2015-05-11
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Publication No.: US09656368B2Publication Date: 2017-05-23
- Inventor: Chan-Kyu Kim , Adolf Zitzmann , KiNam Kim , Josef Zimmermann , Michael Schilp
- Applicant: Corning Precision Materials Co., Ltd. , ZS-Handling GmbH
- Applicant Address: KR DE
- Assignee: Corning Precision Materials Co., Ltd.,ZS-Handling GmbH
- Current Assignee: Corning Precision Materials Co., Ltd.,ZS-Handling GmbH
- Current Assignee Address: KR DE
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: KR10-2014-0056259 20140512
- Main IPC: B24B41/00
- IPC: B24B41/00 ; B24B41/06 ; B25B11/00 ; B23Q3/08 ; H01L21/683 ; H01L21/67 ; B65G47/91

Abstract:
A device for gripping a substrate without contact with which the substrate can be more securely transported. In the device, a housing cap has an air inlet in the upper surface and a lower opening, the lower opening communicating with the air inlet such that air introduced through the air inlet exits through the lower opening. A contour of the lower opening in its vertical cross section is convexly rounded such that the introduced air is guided along a horizontal undersurface of the housing cap. A nozzle is disposed in an inner hollow space of the housing cap, and has an inclined surface such that the width of the nozzle gradually decreases in the direction from the undersurface of the nozzle to the upper surface of the nozzle adjacent to the air inlet. The undersurface of the nozzle is at a predetermined distance from the inner surface of the housing cap. An ultrasonic shaker applies ultrasonic vibration to the housing cap.
Public/Granted literature
- US20150321321A1 Device For Gripping Substrate Without Contact Public/Granted day:2015-11-12
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