Invention Grant
- Patent Title: Apparatus for laminating substrates
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Application No.: US12003792Application Date: 2008-01-02
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Publication No.: US09656450B2Publication Date: 2017-05-23
- Inventor: Yuhwen Lee
- Applicant: Yuhwen Lee
- Applicant Address: TW Taipei
- Assignee: TPK TOUCH SOLUTIONS, INC.
- Current Assignee: TPK TOUCH SOLUTIONS, INC.
- Current Assignee Address: TW Taipei
- Agency: Cooper Legal Group, LLC
- Main IPC: B32B37/10
- IPC: B32B37/10 ; B32B37/00

Abstract:
An apparatus for laminating substrates includes a laminating fixture having an open-topped recessed space formed by a pair of corresponding sidewalls for holding a target substrate therein. The recessed space is communicable with an air evacuation passage. A supporting structure is formed in the recessed space for supporting two opposite ends of a flexible substrate thereon, such that a bottom of the flexible substrate is spaced from a laminating surface of the target substrate by a predetermined distance. A soft plate is disposed over the open-topped laminating fixture to form an airtight chamber in the laminating fixture. When the airtight chamber is vacuumed using a vacuum pump via the evacuation passage, the soft plate is subjected to a suction pressure and downward deformed to press the flexible substrate downward, causing the flexible substrate to deflect to attach its bottom on the laminating surface of the target substrate.
Public/Granted literature
- US20090165957A1 Apparatus for laminating substrates Public/Granted day:2009-07-02
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