Invention Grant
- Patent Title: Liquid ejecting apparatus, head unit, and method of controlling liquid ejecting apparatus
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Application No.: US15225055Application Date: 2016-08-01
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Publication No.: US09656461B2Publication Date: 2017-05-23
- Inventor: Akira Abe , Hiroshi Sugita
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2014-061521 20140325
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14

Abstract:
A liquid ejecting apparatus includes: a modulation circuit that generates a modulated signal obtained by performing pulse modulation on a source signal; a transistor that amplifies the modulated signal to generate an amplified modulated signal; a lowpass filer that smoothes the amplified modulated signal to generate a driving signal; a piezoelectric element that is displaced when the driving signal is applied; and a circuit substrate on which the modulation circuit, the transistor, and the lowpass filter are mounted. The transistor includes a die, a first electrode, a second electrode, a third electrode, a conductive die pad, a first lead which is electrically connected to the second electrode by a bonding wire, and a second lead which is electrically connected to the third electrode by a bonding wire. The die pad, the first lead, and the second lead are electrically connected to different wiring patterns of the circuit substrate.
Public/Granted literature
- US20160339691A1 LIQUID EJECTING APPARATUS, HEAD UNIT, AND METHOD OF CONTROLLING LIQUID EJECTING APPARATUS Public/Granted day:2016-11-24
Information query
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