Invention Grant
- Patent Title: Low expansion glass filler, method of manufacturing the same and glass frit including the same
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Application No.: US14058415Application Date: 2013-10-21
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Publication No.: US09656907B2Publication Date: 2017-05-23
- Inventor: Jhee-Mann Kim , Kiyeon Lee , Jaemin Cha , Jaeho Lee
- Applicant: Samsung Corning Precision Materials Co., Ltd.
- Applicant Address: KR
- Assignee: Corning Precision Materials Co., Ltd.
- Current Assignee: Corning Precision Materials Co., Ltd.
- Current Assignee Address: KR
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: KR10-2012-0117951 20121023
- Main IPC: C03C3/04
- IPC: C03C3/04 ; C03C8/16 ; C03C12/00 ; C03C8/14 ; C03C3/064 ; C03C3/062 ; C03C3/066 ; C03C3/091 ; C03C3/21 ; C03C8/02 ; C03C8/04 ; C03C8/08 ; C03C8/22 ; C03C17/04
Abstract:
A low expansion glass filler which minimizes reflection of laser light during hermetic sealing, a method of manufacturing the same and a glass frit including the same. The low expansion glass filler includes SiO2, Al2O3, B2O3 and CaCO3, the transmittance of the low expansion glass filler being 80% or greater at a wavelength ranging from 630 to 920 nm.
Public/Granted literature
- US20140113134A1 LOW EXPANSION GLASS FILLER, METHOD OF MANUFACTURING THE SAME AND GLASS FRIT INCLUDING THE SAME Public/Granted day:2014-04-24
Information query
