Invention Grant
- Patent Title: Inorganic adhesive composition and hermetic sealing method using same
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Application No.: US14407254Application Date: 2013-06-12
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Publication No.: US09656908B2Publication Date: 2017-05-23
- Inventor: Kiyeon Lee , Jhee-Mann Kim , Jaemin Cha , Jaeho Lee
- Applicant: Corning Precision Materials Co., Ltd.
- Applicant Address: KR
- Assignee: Corning Precision Materials Co., Ltd.
- Current Assignee: Corning Precision Materials Co., Ltd.
- Current Assignee Address: KR
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: KR10-2012-0062736 20120612
- International Application: PCT/KR2013/005156 WO 20130612
- International Announcement: WO2013/187682 WO 20131219
- Main IPC: C09J1/02
- IPC: C09J1/02 ; C03C8/24 ; C09J11/04 ; H01L51/52
Abstract:
The present invention relates to an inorganic adhesive composition and to a hermetic sealing method, and more specifically relates to an inorganic adhesive composition with which an organic solvent is not used and to a hermetic sealing method using same. To this end, the present invention provides an inorganic adhesive composition comprising: between 20 and 80 parts by weight of a water glass diluted solution containing between 60 and 90 parts by weight of water glass (Na2SiO2); between 20 and 80 parts by weight of a refractory inorganic filler; and a black pigment.
Public/Granted literature
- US20150166404A1 INORGANIC ADHESIVE COMPOSITION AND HERMETIC SEALING METHOD USING SAME Public/Granted day:2015-06-18
Information query
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