Invention Grant
- Patent Title: Polyamide hardeners for epdxy resins
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Application No.: US14432870Application Date: 2013-10-22
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Publication No.: US09656977B2Publication Date: 2017-05-23
- Inventor: Eric B. Ripplinger , Rajesh H. Turakhia
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agent Andrew Merriam
- International Application: PCT/US2013/066178 WO 20131022
- International Announcement: WO2014/066386 WO 20140501
- Main IPC: C07D233/24
- IPC: C07D233/24 ; C07D295/13 ; C08G59/14 ; C08G59/50 ; C08G69/34 ; C08G73/02 ; C08G73/06 ; C09D163/00 ; C09J163/00 ; C08L63/00 ; C08L77/08 ; C08L79/02 ; C08L79/04 ; C08G59/44
Abstract:
A polyamide composition comprising a reaction product of: a) an excess of a polyfunctional amine; b) a dimer fatty acid; and c) a monomer fatty acid is disclosed. The polyamide composition can be used as a hardener in epoxy resin formulations.
Public/Granted literature
- US20150252012A1 POLYAMIDE HARDENERS FOR EPOXY RESINS Public/Granted day:2015-09-10
Information query
