Invention Grant
- Patent Title: Resin composition and uses of the same
-
Application No.: US14582233Application Date: 2014-12-24
-
Publication No.: US09657154B2Publication Date: 2017-05-23
- Inventor: Shur-Fen Liu , Meng-Huei Chen , Hsin-Ho Wu
- Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
- Applicant Address: TW Chupei, Hsinchu County
- Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee Address: TW Chupei, Hsinchu County
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW103144283A 20141218
- Main IPC: C08K3/22
- IPC: C08K3/22 ; C08L63/00 ; C08L37/00 ; C08L71/02 ; C08K5/02 ; C08J5/24 ; B32B15/08 ; B32B27/20 ; C08J5/10 ; C09D163/00 ; C08G59/68
Abstract:
A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.
Public/Granted literature
- US20150183952A1 RESIN COMPOSITION AND USES OF THE SAME Public/Granted day:2015-07-02
Information query
