Invention Grant
- Patent Title: Cooling device with cooling passage for liquid refrigerant and juxtaposed fin assembly
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Application No.: US13879977Application Date: 2011-10-12
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Publication No.: US09657997B2Publication Date: 2017-05-23
- Inventor: Satoru Fujita
- Applicant: Satoru Fujita
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-240225 20101027
- International Application: PCT/JP2011/073390 WO 20111012
- International Announcement: WO2012/056880 WO 20120503
- Main IPC: F28F7/00
- IPC: F28F7/00 ; F28D15/00 ; H01L23/473 ; H05K7/20 ; F28F3/04 ; F28F3/12 ; H01L23/367

Abstract:
A cooling device includes a mounting surface, a cooling fin on a rear surface side of the mounting surface, and a cooling passage for cooling the cooling fin with a liquid refrigerant. The refrigerant flows from a flow inlet to the cooling passage and discharges from a discharge outlet. The cooling passage comprises a first surface provided with the cooling fin, a second surface opposing the first surface, and a wall portion between the first surface and the second surface, and is longer than a channel connecting the flow inlet and the discharge outlet. The wall portion has a first wall portion extending from the second surface to the first surface, and a second wall portion extending in parallel with the first wall portion from the first surface to a height exceeding a top portion of the first wall.
Public/Granted literature
- US20130206371A1 COOLING STRUCTURE Public/Granted day:2013-08-15
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