Invention Grant
- Patent Title: Method and device for line pattern shape evaluation
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Application No.: US14897609Application Date: 2014-05-27
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Publication No.: US09658063B2Publication Date: 2017-05-23
- Inventor: Atsuko Yamaguchi , Hiroki Kawada
- Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2013-122614 20130611
- International Application: PCT/JP2014/064006 WO 20140527
- International Announcement: WO2014/199820 WO 20141218
- Main IPC: G01B15/04
- IPC: G01B15/04 ; H01J37/22

Abstract:
The present invention pertains to a method and device for quantitatively evaluating the degree and characteristics of wiggling, which is a phenomenon that occurs in electronic device fabrication processes and consists of the deformation in the same shape of the left and right edges of fine line patterns, and takes advantage of the fact that this wiggling is included in measured values for line edge variation but not line width variation by acquiring the differences between these values. Further, the present invention is configured so as to calculate line center positions and use the distribution of the deviation from the average line center position as an indicator. Additionally, the present invention is configured to quantify wiggling characteristics by outputting a coefficient of wiggling correlation between lines or a wiggling component synchronized between lines as an indicator.
Public/Granted literature
- US20160123726A1 METHOD AND DEVICE FOR LINE PATTERN SHAPE EVALUATION Public/Granted day:2016-05-05
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