- Patent Title: Interchangeable pressure sensor assembly and methods of assembly
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Application No.: US14171170Application Date: 2014-02-03
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Publication No.: US09658126B2Publication Date: 2017-05-23
- Inventor: Ryan Jones , Todd Eckhardt , Richard Wade
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Conley Rose, P.C.
- Agent Kristin Jordan Harkins
- Main IPC: G01L19/04
- IPC: G01L19/04 ; G01L19/14 ; G01L19/00

Abstract:
The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.
Public/Granted literature
- US20140144244A1 INTERCHANGEABLE PRESSURE SENSOR ASSEMBLY AND METHODS OF ASSEMBLY Public/Granted day:2014-05-29
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