Invention Grant
- Patent Title: Metal collection solution and method of analyzing substrate contamination
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Application No.: US14819576Application Date: 2015-08-06
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Publication No.: US09658203B2Publication Date: 2017-05-23
- Inventor: Jiahong Wu , Yuji Yamada , Ayako Mizuno
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: G01N33/20
- IPC: G01N33/20 ; G01N31/00
Abstract:
A metal collection solution according to an embodiment contains 48 wt % or more of HNO3, 6 wt % or less of HCl, and 5 wt % or less of HF. The metal collection solution can collect noble metals and can scan on a substrate. The metal collection solution can be used to collect the noble metals adhered to a surface of the substrate.
Public/Granted literature
- US20160209389A1 METAL COLLECTION SOLUTION AND METHOD OF ANALYZING SUBSTRATE CONTAMINATION Public/Granted day:2016-07-21
Information query
