An assembly strip test method and adapter allows for the concurrent loading of multiple assembly strips for testing in a concurrent and/or round-robin fashion in a strip tester. The test method and adapter allows the multiple assembly strips to be loaded into a strip tester in a single load cycle, reducing assembly strip load cycle overhead. Signals generated by test probes can be used to select between the loaded assembly strips for testing via the strip tester. Parallel coupling between corresponding pins of corresponding integrated circuits of different assembly strips allows a single test probe to be used as stimulus or monitor for two or more assembly strips. In certain configurations a stackable assembly strip test adapter is used. In other configurations the integrated circuits include at least part of the assembly strip selection decoding logic.