Invention Grant
- Patent Title: Fusing device employing induction heating method and image forming apparatus using the same
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Application No.: US14874928Application Date: 2015-10-05
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Publication No.: US09658582B2Publication Date: 2017-05-23
- Inventor: Chi Ken , Kanji Oka , Tatsunori Izawa , Takayuki Horie , Takayuki Yamada
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: JP2014-220364 20141029; KR10-2014-0191134 20141226
- Main IPC: G03G15/20
- IPC: G03G15/20

Abstract:
A fusing device is provided. The fusing device includes a heating roller having two end regions and an inner region between the two end regions, a coil module, and a controller. The coil module includes a first coil arranged along an axial direction of the heating roller; two second coils, one second coil arranged in each end region of the heating roller; and a third coil arranged in the inner region of the heating roller. The controller controls current directions of currents in the first coil, the second coils, and the third coil.
Public/Granted literature
- US20160124360A1 FUSING DEVICE EMPLOYING INDUCTION HEATING METHOD AND IMAGE FORMING APPARATUS USING THE SAME Public/Granted day:2016-05-05
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