Invention Grant
- Patent Title: Measuring and controlling wafer potential in pulsed RF bias processing
-
Application No.: US13663393Application Date: 2012-10-29
-
Publication No.: US09659757B2Publication Date: 2017-05-23
- Inventor: Andras Kuthi , Stephen Hwang , James C. Vetter , Greg Eilenstine , Rongping Wang , Tuan Ngo
- Applicant: LAM RESEARCH CORPORATION
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla Group, LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/66

Abstract:
Apparatus and methods are provided for monitoring a pulsed RF bias signal applied to a chuck in a processing chamber. One method includes operations for detecting voltage values of individual pulses of the pulsed RF bias voltage, and for determining the time for sampling the value of each individual detected pulse. At the sampling time for each pulse, a particular voltage value of the respective individual detected pulse is sampled and the particular voltage value is held. Each particular voltage value represents a characteristic peak-to-peak voltage value of each individual detected pulse. A feedback signal representing the characteristic peak-to-peak voltage value for a voltage envelope of one of the individual detected pulses is generated, and the voltage of the pulsed RF bias voltage signal applied to the chuck is adjusted according to a difference between the feedback signal and a desired voltage value of the pulsed RF bias voltage signal.
Public/Granted literature
- US20130050892A1 MEASURING AND CONTROLLING WAFER POTENTIAL IN PULSED RF BIAS PROCESSING Public/Granted day:2013-02-28
Information query