Invention Grant
- Patent Title: Method and structure for enabling high aspect ratio sacrificial gates
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Application No.: US14524279Application Date: 2014-10-27
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Publication No.: US09659779B2Publication Date: 2017-05-23
- Inventor: Kangguo Cheng , Ryan O. Jung , Fee Li Lie , Jeffrey C. Shearer , John R. Sporre , Sean Teehan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/28 ; H01L29/66 ; H01L27/088 ; H01L29/04 ; H01L29/16 ; H01L29/423 ; H01L29/78 ; H01L21/3213

Abstract:
Sacrificial gate structures having an aspect ratio of greater than 5:1 are formed on a substrate. In some embodiments, each sacrificial gate structure straddles a portion of a semiconductor fin that is present on the substrate. An anchoring element is formed orthogonal to each sacrificial gate structure rendering the sacrificial gate structures mechanically stable. After formation of a planarization dielectric layer, each anchoring element can be removed and thereafter each sacrificial gate structure can be replaced with a functional gate structure.
Public/Granted literature
- US20150372127A1 METHOD AND STRUCTURE FOR ENABLING HIGH ASPECT RATIO SACRIFICIAL GATES Public/Granted day:2015-12-24
Information query
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