Invention Grant
- Patent Title: Chip part and method of making the same
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Application No.: US15170910Application Date: 2016-06-01
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Publication No.: US09659875B2Publication Date: 2017-05-23
- Inventor: Hiroki Yamamoto
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2011-227964 20111017; JP2011-270253 20111209; JP2012-060557 20120316; JP2012-060558 20120316; JP2012-060559 20120316; JP2012-086784 20120405; JP2012-148862 20120702; JP2012-149732 20120703; JP2012-149733 20120703; JP2012-149734 20120703; JP2012-217882 20120928
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L29/06 ; G01R31/26 ; H01L23/544 ; H01L23/495 ; H01L23/522 ; H01L29/861 ; H01L29/866 ; H01L29/872 ; H01L49/02 ; H01L27/06 ; H01L29/417 ; H01L27/102 ; H01L23/31 ; H01L27/02 ; H01L23/00
Abstract:
A chip part includes a substrate, an element formed on the substrate, and an electrode formed on the substrate. A recess and/or projection expressing information related to the element is formed at a peripheral edge portion of the substrate.
Public/Granted literature
- US20160276286A1 CHIP PART AND METHOD OF MAKING THE SAME Public/Granted day:2016-09-22
Information query
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