Invention Grant
- Patent Title: Wafer level shielding in multi-stacked fan out packages and methods of forming same
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Application No.: US14918311Application Date: 2015-10-20
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Publication No.: US09659878B2Publication Date: 2017-05-23
- Inventor: Wei-Yu Chen , Hsien-Wei Chen , An-Jhih Su , Jo-Mei Wang , Tien-Chung Yang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/552 ; H01L23/31 ; H01L23/48 ; H01L23/29 ; H01L25/065 ; H01L21/768 ; H01L21/56 ; H01L21/683 ; H01L21/3205 ; H01L25/00 ; H01L21/78
Abstract:
An embodiment device package includes a device die, a molding compound surrounding the device die, a conductive through inter-via (TIV) extending through the molding compound, and an electromagnetic interference (EMI) shield disposed over and extending along sidewalls of the molding compound. The EMI shield contacts the conductive TIV, and the conductive TIV electrically connects the EMI shield to an external connector. The external connector and the EMI shield are disposed on opposing sides of the device die.
Public/Granted literature
- US20170110413A1 WAFER LEVEL SHIELDING IN MULTI-STACKED FAN OUT PACKAGES AND METHODS OF FORMING SAME Public/Granted day:2017-04-20
Information query
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