Invention Grant
- Patent Title: LED module and LED module packaging structure
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Application No.: US14719783Application Date: 2015-05-22
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Publication No.: US09659913B2Publication Date: 2017-05-23
- Inventor: Masahiko Kobayakawa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2014-109044 20140527
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L25/075 ; H01L33/62 ; H01L33/48

Abstract:
An LED module includes: a substrate including main, rear, and bottom surfaces; a first light emitting element disposed on the main surface; a conductive layer formed on the substrate and electrically coupled with the first light emitting element; a first conductive bonding layer interposed between the first light emitting element and the conductive layer; a main surface insulating film formed on the main surface and covering a portion of the conductive layer; and a first wire, wherein the main surface and the rear surface face opposite directions, the bottom surface connects long sides of the main and rear surfaces, the conductive layer includes a first wire bonding portion where the first wire is bonded, and the main surface insulating film includes a first insulating portion including a portion interposed between the first light emitting element and the first wire bonding portion when viewed in a thickness direction of the substrate.
Public/Granted literature
- US20150348949A1 LED MODULE AND LED MODULE PACKAGING STRUCTURE Public/Granted day:2015-12-03
Information query
IPC分类: