Invention Grant
- Patent Title: Fin replacement in a field-effect transistor
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Application No.: US14568969Application Date: 2014-12-12
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Publication No.: US09660059B2Publication Date: 2017-05-23
- Inventor: Kangguo Cheng , Pouya Hashemi , Ali Khakifirooz , Alexander Reznicek , Dominic J. Schepis
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Steven J. Meyers
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/66 ; H01L29/78

Abstract:
In a method for fabricating a field-effect transistor (FET) structure, forming a fin on a semiconductor substrate. The method further includes forming a gate on a portion of the fin and the semiconductor substrate. The method further includes epitaxially growing a semiconductor material on the fin. The method further includes depositing oxide covering the fin and the epitaxially grown semiconductor material. The method further includes recessing the deposited oxide and the epitaxially grown semiconductor material to expose a top portion of the fin. The method further includes removing the fin. In another embodiment, the method further includes epitaxially growing another fin in a respective trench formed by removing the first set of fins.
Public/Granted literature
- US20160172462A1 FIN REPLACEMENT IN A FIELD-EFFECT TRANSISTOR Public/Granted day:2016-06-16
Information query
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