Invention Grant
- Patent Title: Combination antenna
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Application No.: US14738689Application Date: 2015-06-12
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Publication No.: US09660327B2Publication Date: 2017-05-23
- Inventor: Check Chin Yong
- Applicant: Sony Mobile Communications Inc.
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: SONY CORPORATION,Sony Mobile Communications Inc.
- Current Assignee: SONY CORPORATION,Sony Mobile Communications Inc.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H02J7/02 ; H01Q1/50 ; H01Q1/48

Abstract:
A combination antenna includes a conductive block having at least one electrical component mounted on the surface. A metallic housing is connected to the conductive block via at least one electronic element having a front surface and a rear surface. The front surface includes one or more plates separated by gaps of a predetermined width. The rear surface includes a continuous plate separated from the front surface by a gap of a second predetermined width. One or more antenna feeds are disposed between the front surface and the rear surface of the metallic housing and are connected to the metallic housing directly or via the at least one electronic element. A grounding plane includes one or more grounding points connected to the front surface and the rear surface directly or via the at least one electronic element.
Public/Granted literature
- US20160365621A1 COMBINATION ANTENNA Public/Granted day:2016-12-15
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