Invention Grant
- Patent Title: Conductive connector
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Application No.: US14896431Application Date: 2014-07-18
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Publication No.: US09660371B2Publication Date: 2017-05-23
- Inventor: Hideaki Konno
- Applicant: POLYMATECH JAPAN CO., LTD.
- Applicant Address: JP Saitama
- Assignee: POLYMATECH JAPAN CO., LTD.
- Current Assignee: POLYMATECH JAPAN CO., LTD.
- Current Assignee Address: JP Saitama
- Agency: Cermak Nakajima & McGowan LLP
- Agent Tomoko Nakajima
- Priority: JP2013-169466 20130819
- International Application: PCT/JP2014/069208 WO 20140718
- International Announcement: WO2015/025660 WO 20150226
- Main IPC: H01R4/58
- IPC: H01R4/58 ; H01R13/24 ; H01R4/64 ; H01R11/01

Abstract:
In a connector including a connection portion that is compressed between connection object members (F and F′) and that conductively connects the connection object members (F and F′) to each other, and a base portion that is connected to the connection portion and that forms a recess therein, the connection portion includes a plurality of conductive portions, each conductive portion having conductors arranged in a thickness direction and two electrode planes each in contact with the corresponding one of the connection object members (F and F′), and a retaining portion that retains the conductive portion, the base portion including erect walls and a top wall portion so as to form a recess in the erect walls and the top wall portion, the base portion including, in the recess, partition walls so as to form accommodation portions that accommodate projecting parts (S) connected to the connection object member (F′).
Public/Granted literature
- US20160126655A1 CONNECTOR Public/Granted day:2016-05-05
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