Invention Grant
- Patent Title: Connecting power leads to circuit board
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Application No.: US14375237Application Date: 2013-01-29
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Publication No.: US09661757B2Publication Date: 2017-05-23
- Inventor: Peter Andrew John Finn
- Applicant: Peter Andrew John Finn
- Applicant Address: US MA Westborough
- Assignee: NEC Energy Solutions, Inc.
- Current Assignee: NEC Energy Solutions, Inc.
- Current Assignee Address: US MA Westborough
- Agency: Chapin IP Law, LLC
- International Application: PCT/US2013/023544 WO 20130129
- International Announcement: WO2013/116184 WO 20130808
- Main IPC: H05K3/34
- IPC: H05K3/34 ; H01R12/51 ; H05K1/18 ; H01R12/58 ; H05K1/11 ; H05K1/14 ; H05K3/10 ; H01M2/20

Abstract:
An assembler receives a circuit board. The circuit board includes at least a first node and a second node that are adjacent but electrically isolated from each other. There is a gap between the first node and the second node. The first node is electrically isolated from other components on the circuit board. The second node is electrically coupled to circuitry residing on the circuit board. The assembler initiates positioning of a conductive lead of a battery in a vicinity of the first node. The gap between the first node and second node initially prevents the live conductive lead from being in electrical contact with the second node. Eventually, the assembler bridges the gap to provide an electrical connection between at least the conductive lead and the second node to electrically couple the conductive lead to the second node and thus the circuitry residing on the circuit board.
Public/Granted literature
- US20150008027A1 CONNECTING POWER LEADS TO CIRCUIT BOARD Public/Granted day:2015-01-08
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