Invention Grant
- Patent Title: Resin composition for laser direct structuring, resin molded article, and method for manufacturing molded resin article with plated layer
-
Application No.: US14241634Application Date: 2013-09-12
-
Publication No.: US09663653B2Publication Date: 2017-05-30
- Inventor: Atsushi Motegi , Hiroyoshi Maruyama
- Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- Current Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2012-203366 20120914
- International Application: PCT/JP2013/075388 WO 20130912
- International Announcement: WO2014/042285 WO 20140320
- Main IPC: C08G63/02
- IPC: C08G63/02 ; C08L69/00 ; C08K13/04 ; C23C18/16 ; C23C18/20 ; C23C18/38

Abstract:
Provided is a resin composition capable of achieving a higher plating property. The resin composition comprises, relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass filler and 2 to 20 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive comprises a metal oxide particle comprising titanium oxide coated with a composition comprising tin as a main component and antimony.
Public/Granted literature
Information query