Invention Grant
- Patent Title: Composite conductive films with enhanced thermal stability
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Application No.: US14486775Application Date: 2014-09-15
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Publication No.: US09666337B2Publication Date: 2017-05-30
- Inventor: Whitney Gaynor , George Burkhard
- Applicant: Sinovia Technologies
- Applicant Address: US CA Foster City
- Assignee: Sinovia Technologies
- Current Assignee: Sinovia Technologies
- Current Assignee Address: US CA Foster City
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01B13/00
- IPC: H01B13/00 ; B82Y10/00 ; B82Y40/00 ; G03F7/00 ; G03F7/004 ; G03F7/16 ; G06F3/041 ; H01B1/22 ; H01L51/44 ; B82Y20/00

Abstract:
A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of nanowires of an inorganic material. The nanowires are, in isolated form, characterized by a first conductivity stability temperature. Further, the plurality of nanowires is embedded within at least a region of the layer of cross-linked polymer, where the region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film having a second conductivity stability temperature that is greater than the first conductivity stability temperature.
Public/Granted literature
- US20150038033A1 Composite Conductive Films with Enhanced Thermal Stability Public/Granted day:2015-02-05
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