A thermal sensor with a simple structure can secure the deformability of a bimetal, and accurately control the position of the bimetal, to increase the response speed (heat response) of the bimetal. The thermal sensor includes a bimetal, a case, and a cover member. A pressing portion is provided between the cover member and the bimetal to press the bimetal to a bottom portion of the case. The pressing portion is deformable in accordance with the deformation of the bimetal.