Invention Grant
- Patent Title: Semiconductor packages with a substrate between a pair of substrates
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Application No.: US14828058Application Date: 2015-08-17
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Publication No.: US09666517B2Publication Date: 2017-05-30
- Inventor: Yonghoon Kim
- Applicant: Yonghoon Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2014-0107844 20140819
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/07 ; H01L25/10
Abstract:
Semiconductor packages are provided. A semiconductor package includes a first substrate including a first semiconductor chip thereon. The semiconductor package includes a second substrate on the first substrate, the second substrate including a second semiconductor chip thereon. Moreover, the semiconductor package includes a third substrate between the first and second substrates.
Public/Granted literature
- US20160056103A1 SEMICONDUCTOR PACKAGES WITH A SUBSTRATE BETWEEN A PAIR OF SUBSTRATES Public/Granted day:2016-02-25
Information query
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