An external storage device including an interconnect substrate having a contact type external terminal, at least one semiconductor chip disposed over a first surface of the interconnect substrate, and a sealing resin layer which seals the at least one semiconductor chip and does not cover the external terminal. The at least one semiconductor chip includes a storage device, an inductor being connected to the storage device, a driver circuit configured to control the inductor and an interconnect layer. The interconnect layer is formed at a first surface of the semiconductor chip and includes the inductor. The first surface of the semiconductor chip is other than facing the first surface of the interconnect substrate, and the inductor and the driver circuit are connected to each other through the interconnect layer.