Invention Grant
- Patent Title: Acoustic probe and method of manufacturing the same
-
Application No.: US14153898Application Date: 2014-01-13
-
Publication No.: US09668715B2Publication Date: 2017-06-06
- Inventor: Jin-ho Gu , Jae-yk Kim , Gil-ju Jin
- Applicant: SAMSUNG MEDISON CO., LTD.
- Applicant Address: KR Hongcheon-Gun, Gangwon-Do
- Assignee: SAMSUNG MEDISON CO., LTD.
- Current Assignee: SAMSUNG MEDISON CO., LTD.
- Current Assignee Address: KR Hongcheon-Gun, Gangwon-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0098126 20130819
- Main IPC: A61B8/00
- IPC: A61B8/00 ; B06B1/06
Abstract:
Provided are an acoustic probe and a method of manufacturing the acoustic probe including a chip module substrate, a piezoelectric unit for cross-converting ultrasound and an electric signal while the piezoelectric unit is vibrating, and a connection unit for supporting the piezoelectric unit and electrically connecting the piezoelectric unit and the chip module substrate.
Public/Granted literature
- US20150051493A1 ACOUSTIC PROBE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-02-19
Information query
