Invention Grant
- Patent Title: Punching device for punching network nodes on mold insert and method of punching network nodes using the same
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Application No.: US14335331Application Date: 2014-07-18
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Publication No.: US09669559B2Publication Date: 2017-06-06
- Inventor: Chunlei Cao
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BOE Optical Science and technology Co., Ltd.
- Applicant Address: CN Beijing CN Suzhou
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Suzhou
- Agency: Kinney & Lange, P.A.
- Priority: CN201410080736 20140306
- Main IPC: B26F1/02
- IPC: B26F1/02 ; B26D5/08 ; B26D5/00 ; B26D7/28 ; B26F1/24

Abstract:
The present disclosure relates to a punching device for punching network nodes on a mold insert, comprising: a first horizontal guide rail, a mounting seat, a first driver, a punching mechanism, a laser distance meter, a host computer, a displacement operation controller, and a work platform, wherein the laser distance meter is configured to measure at least one of thicknesses and hole diameters, spacing between the network nodes, and flatness of the mold insert, the displacement operation controller derives an appropriate value of electrical current from measurement results of the laser distance meter and sends it to the host computer, and the host computer supplies electricity to the electromagnetic mechanism in accordance with the value of electrical current, so as to perform an operation of punching the network nodes. In addition, it also relates to a method of punching network nodes on a mold insert using a punching device.
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Information query
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