- Patent Title: Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same
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Application No.: US14834386Application Date: 2015-08-24
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Publication No.: US09670090B2Publication Date: 2017-06-06
- Inventor: Takashi Naito , Shinichi Tachizono , Kei Yoshimura , Yuji Hashiba , Takuya Aoyagi , Taigo Onodera , Tatsuya Miyake
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Co. , Ltd.
- Current Assignee: Hitachi Chemical Co. , Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2014-175642 20140829
- Main IPC: C03C3/21
- IPC: C03C3/21 ; C03C3/12 ; C03C8/02 ; C03C8/14 ; H01L31/068 ; C03C8/24 ; H01L31/0224 ; H01L31/0216 ; H01L51/52 ; H01B1/14 ; H01L41/053 ; C03C8/08 ; C09D5/24 ; C03B23/203 ; C03C3/14 ; C03C8/16 ; C03C8/18 ; H03H9/19 ; H03H3/02 ; H03H9/10 ; H05K1/09

Abstract:
An Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WO3 and P2O5; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of V2O5, TeO2 and Ag2O. Contents of TeO2 and Ag2O each is 1 to 2 times as much as a content of V2O5. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.
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